WOTAN® Ultrasonic

Ultrasonic-assisted grinding for Advanced Materials

With WOTAN® Ultra­sonic, we extend high-pre­ci­sion grind­ing to Advanced Mate­ri­als such as tech­ni­cal ceram­ics, sil­i­con car­bide, fused sil­ica and glass. This opens up new pos­si­bil­i­ties for mate­ri­als, com­po­nents and geome­tries where con­ven­tional grind­ing processes reach their tech­no­log­i­cal limits.

When grinding is about more than the surface

When machin­ing Advanced Mate­ri­als, the process strat­egy must not only meet the high­est require­ments for accu­racy and sur­face qual­ity. At the same time, the mate­r­ial must be machined gen­tly enough to con­sis­tently avoid sub­sur­face dam­age.

WOTAN® Ultra­sonic there­fore sup­ple­ments the grind­ing process with high-fre­quency ultra­sonic motion. The result­ing process kine­mat­ics enable con­trolled mate­r­ial removal at sig­nif­i­cantly lower process forces. 

The benefits

  • reduced process forces
  • mate­r­ial-friendly machin­ing with­out sub­sur­face damage
  • high accu­racy and sur­face quality
  • reduced tool wear
  • higher process reliability
  • new pos­si­bil­i­ties for demand­ing mate­ri­als and geometries

New possibilities for precision machining

Our expe­ri­ence in high-pre­ci­sion metal machin­ing down to the sub-micron range pro­vides the basis for extend­ing WOTAN® tech­nolo­gies to new mate­r­ial groups.

WOTAN® Ultra­sonic opens up addi­tional machin­ing pos­si­bil­i­ties, par­tic­u­larly for tech­ni­cal ceram­ics, sil­i­con car­bide, fused sil­ica and other hard and brit­tle mate­ri­als. This expands the appli­ca­tion spec­trum of WOTAN® grind­ing tech­nolo­gies for high-pre­ci­sion com­po­nents in areas includ­ing optics and pho­ton­ics, pre­ci­sion engi­neer­ing and other high-tech appli­ca­tions.

Smaller com­po­nents and demand­ing geome­tries can also be addressed more effectively.

WOTAN® technology meets Ultrasonic

For WOTAN® Ultra­sonic, we work together with Vibro­Cut GmbH. Its ultra­sonic tech­nol­ogy com­ple­ments our exper­tise in machine tool engi­neer­ing, grind­ing tech­nol­ogy and process development. 

The result is a machin­ing solu­tion that com­bines machine, tech­nol­ogy and process con­trol tai­lored to the respec­tive task – for appli­ca­tions where mate­r­ial, geom­e­try and qual­ity require­ments demand new strategies.

WOTAN® grind­ing machines are designed for a wide range of machin­ing tasks and cus­tomer-spe­cific require­ments. With WOTAN® Ultra­sonic, we extend these capa­bil­i­ties to new mate­ri­als and applications. 

Talk to us about your spe­cific man­u­fac­tur­ing task. Together, we will assess how your mate­ri­als and geome­tries can be machined pre­cisely and reli­ably using WOTAN® technology.

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